NGT offer new and good quality component Chip only. we have our own QC staffs. each batch will do careful test before delivery make sure all goods in good condition.
Process of failure analysis
Background Check -- includingFailure phenomenon, Failure environment, Failure stage (Phases of design, debugging, testing, early application, mid-term application, etc.), Failure proportion, Historical data, etc.
Nondestructive Testing -- like X-Ray fluoroscopy, C-SAM scan, CT scan, Electrical performance test, Morphology, Local composition analysis, etc.
Destructive Analysis -- like De-Cap, Cross-section, Probe test, FIB, Thermal performance test, Body composition analysis, Mechanical behavior test, etc.
Analysis of Using Conditions -- including analysis of structural, mechanics, thermal analysis, environmental conditions, restrictions, etc.
Simulation and Verification Experiments -- according to the failure mechanism, design simulation experiment, verify the failure.
Contact Person: Mr. Tyler